ThruChip Interface (TCI) employing inductive coupling bares comparison with Through Silicon Via (TSV) in terms of data rate (11Gb/s/ch), reliability (BER≪10–14), and energy dissipation (0.14pJ/b). It is less expensive than TSV by 20¢/chip, though, since it is implemented by digital circuits in a standard CMOS. ESD protection devices can be eliminated to further lower delay, power, and area. It exhibits high noise immunity and alignment tolerance. It provides with an AC coupling link to make interface design easy under multiple/variable VDD''s. The cost/performance will further be improved exponentially by thinning chip thickness. Applications include Solid-State Drive (SSD) by stacking NAND Flash memories, a high-speed low-power DRAM interface, bus probing through package for debugging, and non-contact wafer testing. Wireless power delivery by using inductive coupling will further widen the applications. This talk will cover basics, applications, and future perspectives of the TCI.
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机译：采用感应耦合的ThruChip接口（TCI）在数据速率（11Gb / s / ch），可靠性（BER≪10-14）和能量耗散（0.14pJ / b）方面与通过硅通孔（TSV）几乎没有比较。但是，由于它是由标准CMOS中的数字电路实现的，因此其价格比TSV低20美分/芯片。可以省去ESD保护器件，以进一步降低延迟，功耗和面积。它具有很高的抗噪能力和对准公差。它提供了一个交流耦合链路，可以在多个/可变VDD电压下简化接口设计。通过减小芯片厚度，成本/性能将进一步得到指数级改善。应用包括通过堆叠NAND闪存的固态驱动器（SSD），高速低功耗DRAM接口，用于封装的总线探测以进行调试以及非接触式晶片测试。通过使用电感耦合进行无线电力传输将进一步扩大应用范围。本演讲将涵盖TCI的基础知识，应用和未来前景。
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