Work Around Moore's Law: Current and Next Generation Technologies

摘要

Interconnect dimensions and CMOS transistor feature size approach their physical limits, therefore scaling will no longer play an important role in performance improvement. So, instead of trying to improve the performance of traditional CMOS circuits, integration of multiple technologies and different components in a heterogeneous system that is high performance will be introduced "moore than more" and CMOS replacemenfbeyond CMOS" will be explored. This paper focuses on Technology level trends where it presents "More Moore":New Architectures (SOI, FinFET, Twin-Well),"More Moore" :New Materials (High-K, Metal Gate, Strained-Si) ,"More than Moore":New Interconnects Schemes (3D, NoC, Optical, Wireless), and "Beyond CMOS" :New Devices (Molecular Computer, Biological computer, Quantum Computer).