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SOI CMOS Compact Modeling based on TCAD Device Simulations

机译:基于TCAD器件仿真的SOI CMOS紧凑建模

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摘要

The aggressive product development schedules demanded by today's marketplace require that early circuit design work overlaps substantially with process development activity. To support this, device models must be available prior to fabrication of the finalized CMOS device design. This work describes a Technology Computer Aided Design (TCAD) -based methodology for generating compact models in advance of hardware availability. The exercise was performed on a 65nm node SOI CMOS technology. TCAD was used in the conventional way to extrapolate interim CMOS devices to target performance by simulating planned process improvements. The resulting TCAD simulations were used to generate Ⅰ-Ⅴ and C-V data for compact model extraction. The extracted model is compared with TCAD simulations and the fit is shown to be good.
机译:当今市场所要求的激进的产品开发时间表要求早期电路设计工作与过程开发活动实质上重叠。为此,必须在制造最终的CMOS器件设计之前提供器件模型。这项工作描述了一种基于技术计算机辅助设计(TCAD)的方法,用于在硬件可用性之前生成紧凑模型。该练习是在65nm节点SOI CMOS技术上进行的。 TCAD以传统方式用于通过模拟计划的过程改进来推断临时CMOS器件以达到目标性能。 TCAD仿真结果用于生成Ⅰ-Ⅴ和C-V数据,以进行紧凑模型提取。将提取的模型与TCAD仿真进行比较,证明拟合良好。

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