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SOLDER JOINT INSPECTION MODEL TRAINING METHOD, SOLDER JOINT INSPECTION METHOD, AND SOLDER JOINT INSPECTION DEVICE

机译:焊点检查模型训练方法,焊接接头检测方法和焊接接头检测装置

摘要

A solder joint inspection model training method includes the steps of: training a first identification model according to first sample images to identify a surface-mount device with a solder joint in an image; training a second identification model according to second sample images to identify a surface-mount device without a solder joint in an image; inputting labeled original images to a trained first identification model to output first images; inputting the first images to a trained second identification model to output second images; masking the first images with the second images to generate images with normal solder joints and images with abnormal solder joints; and training a solder joint inspection model based on the images with normal solder joints and the images with abnormal solder joints.
机译:焊接接头检查模型训练方法包括以下步骤:根据第一样本图像训练第一识别模型,以识别图像中的焊点的表面安装装置; 根据第二个样本图像训练第二个识别模型,以识别没有图像中的焊点的表面安装装置; 将标记的原始图像输入到训练有素的第一识别模型以输出第一张图像; 将第一个图像输入到训练的第二识别模型以输出第二图像; 用第二个图像掩蔽第一图像,以产生具有正常焊点的图像和具有异常焊点的图像; 基于具有正常焊点的图像和具有异常焊点的图像训练焊接接头检查模型。

著录项

  • 公开/公告号US2022023977A1

    专利类型

  • 公开/公告日2022-01-27

    原文格式PDF

  • 申请/专利权人 PEGATRON CORPORATION;

    申请/专利号US202117361646

  • 发明设计人 CHUN-CHOU CHENG;MING-LUNG LEE;

    申请日2021-06-29

  • 分类号B23K31/12;B23K31;G06T7;G06N3/08;G06N3/04;

  • 国家 US

  • 入库时间 2022-08-24 23:33:50

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