Phenol compound, phenol curing agent, thermosetting resin composition and method for producing phenol compound

摘要

PROBLEM TO BE SOLVED: To provide a phenol compound capable of obtaining a thermosetting resin composition having excellent handleability and further obtaining a cured product having excellent thermal conductivity and heat resistance. The phenolic compound of the present invention is represented by the following general formula (1). (In the general formula (1), R and Q each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms. A plurality of R or a plurality of present. Q may be the same or different.) [Selection diagram] None