An STL model slicing method, comprising: reading and loading an STL model; obtaining a first slice plane; according to a first set thickness, making the first slice plane be horizontally tangential to an STL model to obtain a first profile curve, wherein the first profile curve is a profile curve of a tangent plane of the STL model and the first slice plane; determining whether the profile curve contains a physical portion of the STL model; if the profile curve contains the physical portion of the STL model, filling the physical portion with white to obtain a white portion; determining a non-physical portion in the profile curve according to the physical portion; filling the non-physical portion with black to form a mask of the tangent plane; and projecting the mask onto a liquid photosensitive resin by means of a first 3D printer, and then curing the white portion to be a first cured profile. Therefore, the effects of accurately acquiring contour information of a slice bitmap, improving the accuracy of slice bitmap printing, and improving the accuracy of a 3D printing model are realized.
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