首页> 外国专利> Solder product manufacturing method, solder, solder component, solder product, printed wiring board, printed circuit board, wire rod, solder product, flexible printed circuit board, electronic component, tin molded product manufacturing method, tin intermediate product manufacturing method, tin molded product, tin intermediate Product and conductive member

Solder product manufacturing method, solder, solder component, solder product, printed wiring board, printed circuit board, wire rod, solder product, flexible printed circuit board, electronic component, tin molded product manufacturing method, tin intermediate product manufacturing method, tin molded product, tin intermediate Product and conductive member

机译:焊料产品制造方法,焊料,焊接元件,焊料产品,印花配线板,印刷电路板,线材,焊锡产品,柔性印刷电路板,电子元件,锡模制产品制造方法,锡中间产品制造方法,锡模制品 ,锡中间产品和导电构件

摘要

A solder product comprising: a lead-free solder portion 21 containing tin as a main component and consisting of a metal element other than lead as a minor component; (20). It is preferable that it is a C12 or more and 16 or less fatty acid, and, as for carboxylic acid, it is more preferable that it is palmitic acid.
机译:焊料产品包括:含有锡作为主要成分的无铅焊料部分21,并由除引线以外的金属元素组成; (20)。 优选的是,它是C12或更长且16或更少的脂肪酸,以及对于羧酸,更优选棕榈酸。

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