INFO INFO STRUCTURE AND METHOD FORMING SAME

摘要

The method includes encapsulating a package component within an encapsulating material, the encapsulating material comprising a portion directly over the package component. A portion of the encapsulating material is patterned to form an opening that exposes the conductive features in the package component. A wiring line extends into the opening to contact the conductive feature. An electrical connector is formed over the conductive feature to be electrically coupled to the conductive feature.