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Woody base material and cosmetic material using the same

机译:木质基材和化妆品使用相同

摘要

Problem to be solved: to provide a wood base material excellent in mechanical strength and water resistance, and a decorative material using the same."Powdery or chip like wood material 11"The powdery thermoplastic resin composition 12 andA wood substrate 11 formed by heating and pressurizing a raw material mixture 10 comprisingThermoplastic resin composition 12Thermoplastic resinOrganic peroxides of 0.1 to 3 parts by mass with 100 parts by weight of the thermoplastic resinIncludingRaw material mixtureThe total weight of the wood material 11 and the thermoplastic resin composition 12 is 100 parts by weight.An alkoxysilane compound of 0.1 to 8 mass parts is contained in 100 parts by mass.The alkoxysilane compound may also contain at least one of the vinyl group and the meta (acrylic) group, the alkoxysilane compound may further comprise at least one of the amino group, the epoxy group, and the mercapto group, and the thermoplastic resin composition Unsaturated dicarboxylic acid may be included.Diagram
机译:要解决的问题:提供机械强度和耐水性优异的木材基材,以及使用该的装饰材料。“粉状或芯片如木材11”,粉末状热塑性树脂组合物12和通过加热形成的木材基板11。加压原料混合物10包含热塑性树脂组合物的120重量份热塑性树脂CludingRAW材料混合物的热塑性树脂组合物120重量份的木材材料11和热塑性树脂组合物12的总重量为100重量份。 0.1至8质量份的烷氧基硅烷化合物含有100质量份。烷氧基硅烷化合物还可含有至少一种乙烯基和或丙烯酸酯(丙烯酸)基团,烷氧基硅烷化合物可进一步包含氨基中的至少一种,环氧基团和巯基,热塑性树脂组合物不饱和二羧酸可以是i ncluded.diagram.

著录项

  • 公开/公告号JP2021172009A

    专利类型

  • 公开/公告日2021-11-01

    原文格式PDF

  • 申请/专利权人 凸版印刷株式会社;

    申请/专利号JP20200077529

  • 发明设计人 大久保 透;

    申请日2020-04-24

  • 分类号B27N3/02;B27M1/08;B32B21/04;

  • 国家 JP

  • 入库时间 2022-08-24 22:01:15

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