Chemical mechanical polishing composition containing composite silica particle, method for producing silica composite particle, and method for polishing substrate

摘要

Problem to be solved: to provide a chemical mechanical polishing composition having improved silica to improve the rate of removal of silicon dioxide at acidic pH.Chemical mechanical polishing compositions include silica cores containing water and nitrogen species, cerium compound coatings containing cerium oxide, cerium hydroxide or mixtures thereof, and colloidal silica grains having positive zeta potentials Optionally comprises an oxidizing agent, optionally optionally a pH regulator, optionally a biocide, and optionally a surfactant.The chemical mechanical polishing composition has less than pH 7.Also described is a method of polishing a substrate containing silicon dioxide, and a method of producing composite colloidal silica particles having cerium oxide, cerium hydroxide or coating thereof.No selection