Smart Packages and Methods for Intelligent Control of Heating in Smart Packages

摘要

Various smart package configurations may include a package intelligence and communication module (PICM) that intelligently interacts with smart heating appliances and users. The thermodynamic load profile may correlate the thermodynamic response characteristics of the package and may be stored in the PICM or associated with a unique identifier in the PICM. TLP enables efficient and safe heating of packages on smart devices, as well as package validation and authentication. Package configurations also include structural elements for efficient heating of food, beverage, cosmetic and personal care products.