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CURVED IMAGING SENSOR PACKAGE WITH ARCHITECTED SUBSTRATE
CURVED IMAGING SENSOR PACKAGE WITH ARCHITECTED SUBSTRATE
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机译:弯曲成像传感器包装,带有架构基板
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摘要
An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.
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