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Blanking lower mold, lower mold substrate, blanking type, and replacement method of the lower mold substrate

机译:消隐下模具,下模板,消隐型和下模基材的更换方法

摘要

Problem to be solved: to provide a method of replacing a blanking under type, a lower mold substrate, a blanking type, and a lower mold substrate in which a manufacturing cost can be reduced more than in the prior art.The lower mold substrate is removably mounted on the frame portion 40 in the blanking undertype. In the frame portion 40, the movable partition plates 53a and 53c for partitioning the periphery of the product portion falling holes between the pair of opposed frame portions 52A and 52b and supporting the lower mold substrate are slidably provided along the frame portions 52A and 52b in accordance with the forming positions of the product portion falling holes of the lower mold substrate.Diagram
机译:要解决的问题:提供一种在类型,下模具基板,消隐型和下模具基板下更换消隐的方法,其中制造成本可以比现有技术更低。下模具基板是 可拆卸地安装在框架部分40上,在凹陷下面。 在框架部分40中,可移动隔板53a和53c用于划分一对相对的框架部分52a和52b之间的产品部分下降孔的周边并沿着框架部分52a和52b可滑动地设置 根据下模底底的产品部分落孔的形成位置.Diagram

著录项

  • 公开/公告号JP2021130179A

    专利类型

  • 公开/公告日2021-09-09

    原文格式PDF

  • 申请/专利权人 株式会社スリーブイ;

    申请/专利号JP20200027620

  • 发明设计人 梶井 剛志;

    申请日2020-02-20

  • 分类号B26D7/18;B26F1/44;

  • 国家 JP

  • 入库时间 2022-08-24 20:57:58

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