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THERMAL IMAGING FOR WITHIN WAFER VARIABILITY FEEDFORWARD OR FEEDBACK INFORMATION
THERMAL IMAGING FOR WITHIN WAFER VARIABILITY FEEDFORWARD OR FEEDBACK INFORMATION
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机译:在晶圆变异前馈或反馈信息中的热成像
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摘要
IR radiation may be used to examine substrates prior to a fabrication operation in order to adjust processing parameters of the fabrication operation, or to determine features of the substrate. A thermographic image may be collected and provided to a transfer function or machine learning model to determine processing parameters or features. The processing parameters may improve the uniformity of the wafer and/or achieve a desired target feature value.
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