首页> 外国专利> TREATMENT CONDITION SPECIFICATION METHOD, SUBSTRATE TREATMENT METHOD, SUBSTRATE PRODUCT MANUFACTURING METHOD, COMPUTER PROGRAM, STORAGE MEDIUM, TREATMENT CONDITION SPECIFICATION DEVICE, AND SUBSTRATE TREATMENT DEVICE

TREATMENT CONDITION SPECIFICATION METHOD, SUBSTRATE TREATMENT METHOD, SUBSTRATE PRODUCT MANUFACTURING METHOD, COMPUTER PROGRAM, STORAGE MEDIUM, TREATMENT CONDITION SPECIFICATION DEVICE, AND SUBSTRATE TREATMENT DEVICE

机译:处理条件规范方法,衬底处理方法,基板产品制造方法,计算机程序,存储介质,处理条件规范装置,以及基板处理装置

摘要

In this treatment condition specification method, a recipe information item usable when a substrate W is treated while a treatment liquid discharge position is moved is specified from among a plurality of recipe information items. This treatment condition specification method includes step S31, step S32, and step S33. In step S31, on the basis of measured thickness information including a measurement value of the thickness of a substrate W, predictive thickness information including a predictive value of the thickness of the substrate W after treatment is calculated for each of the recipe information items. In step S32, the predictive thickness information calculated for each of the recipe information items is evaluated in accordance with a predetermined evaluation method, and a predictive thickness information item is selected from among the plurality of predictive thickness information items. In step S33, a recipe information item corresponding to the selected predictive thickness information item is specified. The measurement value included in the measured thickness information indicates the thickness of the substrate W measured before treatment of the substrate W.
机译:在该处理条件规范方法中,从多个配方信息项中指定了在处理衬底W时可用的配方信息项。该处理条件规范方法包括步骤S31,步骤S32和步骤S33。在步骤S31中,基于包括基板W的厚度的测量值的测量厚度信息,针对每个配方信息项计算包括衬底W的厚度的预测值的预测厚度信息。在步骤S32中,根据预定的评估方法评估为每个配方信息项计算的预测厚度信息,并且从多个预测厚度信息项中选择预测厚度信息项。在步骤S33中,指定对应于所选择的预测厚度信息项的配方信息项。包括在测量的厚度信息中的测量值表示在处理基板W之前测量的基板W的厚度。

著录项

  • 公开/公告号WO2021152983A1

    专利类型

  • 公开/公告日2021-08-05

    原文格式PDF

  • 申请/专利权人 SCREEN HOLDINGS CO. LTD.;

    申请/专利号WO2020JP43838

  • 发明设计人 INAGI DAI;SHIMANO TATSUYA;OTA TAKASHI;

    申请日2020-11-25

  • 分类号H01L21/306;

  • 国家 JP

  • 入库时间 2022-08-24 20:23:07

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