ELECTRONIC GROUP WITH ENTERPRISES AND OPERATING PROCEDURES OF THE ELECTRONIC GROUP

摘要

Electronic assemblies comprising:a number of first semiconductor chips (1), each of which has a first load connection (11) and a second load connection (12);a conductor structure (6) with a first conductor strip (61), a second conductor strip (62) and a third conductor strip (63);a number of first capacitors (3) mounted on the conductor structure (6) each with a first capacitor connection (31) and a second capacitor connection (32); anda radiator (200); where:the first load connection (11) of each first semiconductor chip (1) is electrically connected to the first conductor strap (61);the second load connection (12) of each first semiconductor chip (1) is electrically connected to the third conductor strap (63);the first capacitor connection (31) of each first capacitor (3) is electrically connected to the first conductor strip (61);the second capacitor connection (32) of each first capacitor (3) is electrically connected to the second conductor strip (62); andthe radiator (200) is electrically connected to the second conductor strip (62),where the electronic assemblies have a number of second semiconductor chips (2), each of which has a first load connection (21) and a second load connection (22), where:the conductor structure (6) has a fifth conductor strip (65);the first load connection (21) of each second semiconductor chip (2) is electrically connected to the third conductor strip (63); andthe second load connection (22) of each second semiconductor chip (2) is electrically connected to the fifth conductor strap (65),where the conductor structure (6) has a fourth conductor strip (64) electrically connected to the second conductor strip (62) and where the first conductor strip (61) and the fifth conductor strip (65) are located between the second conductor strip (62) and the fourth conductor strip (64).