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CMC components having microchannels and methods for forming microchannels in CMC components

机译:具有微通道和用于在CMC组件中形成微通道的微通道和方法的CMC组件

摘要

CMC components having microchannels and methods for forming microchannels in CMC components are provided. For example, a method for forming microchannels in a CMC component comprises laying up a plurality of body plies for forming a body of the CMC component; laying up a microchannel ply on the plurality of body plies that has at least one void therein for forming at least one microchannel; laying up a cover ply on the microchannel ply to define an outer layer of the CMC component; and processing the laid up body plies, microchannel ply, and cover ply to form the CMC component. In another embodiment, the method comprises applying an additive matrix to the body plies to define at least one microchannel. In still other embodiments, the method comprises machining at least one microchannel in the plurality of body plies.
机译:提供了具有微通道和用于在CMC部件中形成微通道的微通道和方法的CMC组件。例如,在CMC部件中形成微通道的方法包括铺设多个主体层,用于形成CMC部件的主体;在其中在其中的多个体层上铺设微通道帘布层,其在其中至少有一个空隙,用于形成至少一个微通道;在微通道层上铺设盖子,以限定CMC成分的外层;并处理铺设的身体层,微通道层,覆盖层,以形成CMC组分。在另一个实施方案中,该方法包括将添加剂矩阵施加到身体层中以限定至少一个微通道。在其他实施例中,该方法包括在多个主体层中加工至少一个微通道。

著录项

  • 公开/公告号US11047240B2

    专利类型

  • 公开/公告日2021-06-29

    原文格式PDF

  • 申请/专利权人 GENERAL ELECTRIC COMPANY;

    申请/专利号US201715592516

  • 申请日2017-05-11

  • 分类号F01D5/18;F01D5/28;F04D29/58;F01D5/14;F04D29/38;B23P15/02;F01D9/02;F01D25/12;F04D29/32;F04D29/54;

  • 国家 US

  • 入库时间 2022-08-24 19:39:12

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