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ELECTROLESS NICKEL ALLOY PLATING BATHS, A METHOD FOR DEPOSITION OF NICKEL ALLOYS, NICKEL ALLOY DEPOSITS AND USES OF SUCH FORMED NICKEL ALLOY DEPOSITS
ELECTROLESS NICKEL ALLOY PLATING BATHS, A METHOD FOR DEPOSITION OF NICKEL ALLOYS, NICKEL ALLOY DEPOSITS AND USES OF SUCH FORMED NICKEL ALLOY DEPOSITS
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机译:化学镍合金电镀浴,一种沉积镍合金的方法,镍合金沉积物和这种形成的镍合金沉积物的用途
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摘要
The present invention relates to an electroless nickel alloy plating bath comprising nickel ions; further reducible metal ions selected from the group consisting of molybdenum ions, rhenium ions, tungsten ions, copper ions, oxo-ions thereof, and mixtures thereof; at least one reducing agent suitable to reduce the nickel ions and the further reducible metal ions to their respective metallic state; complexing agents CA1, CA2, CA3, and CA4, wherein CA1, CA2, CA3, and CA4 are all different from each other, wherein each of CA1 and CA2 is independently selected from the group consisting of compounds having at least two carboxylic acid moieties, the respective salts thereof as well as mixtures of the aforementioned; wherein CA3 is selected from the group consisting of aliphatic compounds having exactly one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned; and wherein CA4 is selected from the group consisting of aromatic compounds having at least one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned.
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