首页> 外国专利> Thermally conductive cover for piping system, heating device for piping system, manufacturing method and attachment method for thermally conductive cover, and manufacturing method and attachment method for heating device

Thermally conductive cover for piping system, heating device for piping system, manufacturing method and attachment method for thermally conductive cover, and manufacturing method and attachment method for heating device

机译:管道系统的导热盖,管道系统的加热装置,用于导热盖的制造方法和附接方法,以及用于加热装置的制造方法和附接方法

摘要

A thermally conductive cover improves workability of attachment and detachment. The thermally conductive cover includes a first thermal conductor on which a coupling hole is formed and a second thermal conductor on which a coupling hole is formed. The thermally conductive cover further includes a coupling member having a first inserted part to be inserted into the coupling hole and a second inserted part to be inserted into the coupling hole. At least one of the inserted parts is elastically deformable in a direction perpendicular to an inserting direction of the coupling member.
机译:导热覆盖改善了附着和脱离的可加工性。导热盖包括第一热导体,在该第一导热器上,形成耦合孔以及形成连接孔的第二导热器。导热盖还包括连接构件,该连接构件具有插入联接孔中的第一插入部分和将第二插入部分插入到联接孔中。至少一个插入的部件在垂直于联接构件的插入方向的方向上弹性变形。

著录项

  • 公开/公告号US11009170B2

    专利类型

  • 公开/公告日2021-05-18

    原文格式PDF

  • 申请/专利权人 NICHIAS CORPORATION;

    申请/专利号US201716483348

  • 发明设计人 KAORI YAMASHITA;

    申请日2017-02-16

  • 分类号H05B3/58;F16L53/38;F16B19;F16L59;F16L58;

  • 国家 US

  • 入库时间 2022-08-24 18:43:31

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