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Thermally conductive cover for piping system, heating device for piping system, manufacturing method and attachment method for thermally conductive cover, and manufacturing method and attachment method for heating device
Thermally conductive cover for piping system, heating device for piping system, manufacturing method and attachment method for thermally conductive cover, and manufacturing method and attachment method for heating device
A thermally conductive cover improves workability of attachment and detachment. The thermally conductive cover includes a first thermal conductor on which a coupling hole is formed and a second thermal conductor on which a coupling hole is formed. The thermally conductive cover further includes a coupling member having a first inserted part to be inserted into the coupling hole and a second inserted part to be inserted into the coupling hole. At least one of the inserted parts is elastically deformable in a direction perpendicular to an inserting direction of the coupling member.
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