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SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
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机译:用于电源模块的基板,带散热器,带散热器的电源模块,以及用散热器的电力模块生产基板的方法
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摘要
A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface.
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