A method for manufacturing a third laminated body, a method for manufacturing a fourth laminated body, a method for manufacturing a semiconductor device with a back surface protective film, and a third laminated body.

摘要

In the present invention, one surface of the work (14) is a circuit surface (14a), the other surface is a back surface (14b), and one surface of the back surface protective film forming film (13) is a smooth surface. (13b), the other surface is a rough surface (13a) that is coarser than the smooth surface (13b), and the back surface (14b) of the work (14) is covered with the rough surface (13) of the back surface protective film forming film (13). The first laminating step of sticking 13a) face-to-face and the second laminating step of sticking the support sheet (10) on the smooth surface (13b) of the back surface protective film forming film (13) are performed in this order. The present invention relates to a method for producing the third laminated body (19).