首页> 外国专利> METHOD FOR MANUFACTURING A FLUID-EJECTION DEVICE WITH IMPROVED RESONANCE FREQUENCY AND FLUID EJECTION VELOCITY, AND FLUID-EJECTION DEVICE

METHOD FOR MANUFACTURING A FLUID-EJECTION DEVICE WITH IMPROVED RESONANCE FREQUENCY AND FLUID EJECTION VELOCITY, AND FLUID-EJECTION DEVICE

机译:具有改进的共振频率和流体喷射速度的流体喷射装置的方法,以及流体喷射装置

摘要

A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.
机译:一种用于制造用于喷射流体的装置的方法,包括:在容纳喷射装置的喷嘴的第一半导体晶片中,形成:形成第一结构层的步骤。去除第一结构层的选择性部分以形成用于含有流体的腔室的第一部分;在第二半导体晶片中移除,该第二半导体晶片容纳喷射装置的致动器,第二结构层的选择性部分以形成腔室的第二部分;并将第一和第二半导体晶片耦合在一起,使得第一部分直接面向第二部分,从而形成腔室。第一部分限定腔室的容积的一部分,其大于由第二部分限定的腔室的体积的相应部分。

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