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METHOD FOR MANUFACTURING A FLUID-EJECTION DEVICE WITH IMPROVED RESONANCE FREQUENCY AND FLUID EJECTION VELOCITY, AND FLUID-EJECTION DEVICE
METHOD FOR MANUFACTURING A FLUID-EJECTION DEVICE WITH IMPROVED RESONANCE FREQUENCY AND FLUID EJECTION VELOCITY, AND FLUID-EJECTION DEVICE
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机译:具有改进的共振频率和流体喷射速度的流体喷射装置的方法,以及流体喷射装置
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摘要
A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.
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