PANEL TRANSDUCER SCALE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a fïrst carrier sub strate with a fïrst surface of the acoustic components positioned adjacent to the fïrst carrier substrate. ASIC components are also secured at predetermined locations on the fïrst carrier substrate with a fïrst surface of the ASIC components positioned adjacent to the fïrst carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The fïrst carrier substrate is removed to expose the fïrst surface of the acoustic components and the fïrst surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.