METALLIC PLATE, METAL-RESIN COMPOSITE, SEMICONDUCTOR DEVICE, AND METALLIC PLATE PRODUCTION METHOD

摘要

This metallic plate 1 has a resin-covered surface covered with a resin member, wherein the metallic plate 1 has at least three recesses 2 that are formed side by side on the resin-covered surface so as to sink into the resin-covered surface, at least three of the recesses 2 lined up in a recess-array direction Da are arranged apart from each other on the resin-covered surface at multiple types of pitches P1, P2 of different distances.