3D PRINTING OF FULLY DENSE AND CRACK FREE SILICON WITH SELECTIVE LASER MELTING/SINTERING AT ELEVATED TEMPERATURES

摘要

In a fully dense printing method, a plurality of buffer layers of silicon are initially printed on a steel substrate, and then layers of silicon for the actual component are printed on top of the buffer layers using a double printing method. In a fully dense and crack free printing method, one or more heaters and thermal insulation are used to minimize temperature gradient during Si printing, in-situ annealing, and cooling.