METHOD AND APPARATUS FOR FORMING HOLES IN BRITTLE MATERIALS ASSISTED BY STRESS REDUCTION THROUGH HEATING

摘要

A method of making a brittle substrate comprising the steps of: (i)heating at least a portion of the substrate at least to the depth d to a temperature Tp that is above 500 ^oC, but below 1500 ^oC, to form a heated area of the substrate; and (ii) irradiating at least a portion of the heated area of the brittle substrate with a laser beam emitted from an IR laser to form at least one hole in the brittle substrate.