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Plating Solution Composition having Ruthenium and Method of plating using the same
Plating Solution Composition having Ruthenium and Method of plating using the same
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机译:具有钌的电镀溶液组合物和使用相同的电镀方法
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摘要
The present invention is an alloy plating solution composition containing ruthenium, characterized in that it comprises 3.0 to 5.0 parts by weight of gold potassium cyanide, 0.01 to 2.0 parts by weight of ruthenium sulfate, 50 to 80 parts by weight of citric acid, and 30 to 50 parts by weight of sulfamic acid.
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