首页> 外国专利> Wiring board and mounting structure using it

Wiring board and mounting structure using it

机译:配线板和安装结构使用它

摘要

PROBLEM TO BE SOLVED: To easily insert an optical fiber into a wiring board and easily fix it in a vertical direction. A wiring board 2 is located on an insulating substrate 20 including a plurality of insulating layers 221 and upper and lower surfaces, a mounting area X located on the upper surface of the insulating substrate, and upper and lower surfaces of the respective insulating layers. , A wiring conductor 222 including a plurality of pads 222a located in a mounting area. The insulating substrate has a through hole 24 penetrating from the lower surface to the upper surface. The through hole is a first portion 24a having a first opening 241 on the lower surface, a second portion 24b having a second opening 242 in the mounting region on the upper surface, and a third portion located between the first portion and the second portion. It has 24c and. The average diameter of the second part is smaller than the average diameter of the first part. The third portion includes a portion whose diameter decreases in the direction from the first portion to the second portion. [Selection diagram] Fig. 1
机译:要解决的问题:以便将光纤插入布线板中并在垂直方向上轻松固定。布线板2位于绝缘基板20上,所述绝缘基板20上包括多个绝缘层221和上表面和下表面,位于绝缘基板的上表面上的安装区域x和相应的绝缘层的上表面和下表面。 ,包括位于安装区域中的多个焊盘222a的布线导体222。绝缘基板具有从下表面穿透到上表面的通孔24。通孔是第一部分24a,第一部分24a在下表面上具有第一开口241,第二部分24b在上表面上的安装区域中具有第二开口242,以及位于第一部分和第二部分之间的第三部分。它有24℃和。第二部分的平均直径小于第一部分的平均直径。第三部分包括直径在从第一部分到第二部分的方向上减小的部分。 [选择图]图1

著录项

  • 公开/公告号JP2021034703A

    专利类型

  • 公开/公告日2021-03-01

    原文格式PDF

  • 申请/专利权人 京セラ株式会社;

    申请/专利号JP20190157319

  • 发明设计人 熊野 篤;太田 英昭;

    申请日2019-08-29

  • 分类号H05K1/02;H05K3/46;H01L23/12;G02B6/42;H01L31/0232;H01S5/022;

  • 国家 JP

  • 入库时间 2022-08-24 17:24:44

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号