instrument for curing of epoxy resins, approach to the use of the product and processes for the manufacture of an organic dianhydrid for use in the product.

• 1. 环氧树脂组合物、半固化或固化环氧树脂组合物及它们的制造方法、使用这些组合物的产品 [P] . 中国专利： CN107312161B . 2021.10.26
• 2. 环氧树脂组合物、半固化或固化环氧树脂组合物及它们的制造方法、使用这些组合物的产品 [P] . 中国专利： CN107312161A . 2017-11-03
• 3. The composition of curing agent for epoxy resins, use of a composition of curing agent for epoxy resins and product. [P] . BRPI0603816A . 2008-05-06

  机译： 环氧树脂用固化剂的组成，环氧树脂用固化剂的组成和产品的用途。

• 4. Semiconductor device manufacturing method a cured product of an organic compound, an epoxy resin composition of the epoxy resin and formed by using the epoxy resin [P] . 日本专利： JPWO2004007586A1 . 2005-11-10

  机译： 半导体器件的制造方法是有机化合物的固化物，环氧树脂的环氧树脂组合物以及使用该环氧树脂形成的半导体器件的制造方法

• 5. Phenolic resins, epoxy resins, process for their preparation, the epoxy resin composition and cured product. [P] . 日本专利： JP5734603B2 . 2015-06-17

  机译： 酚醛树脂，环氧树脂，其制备方法，环氧树脂组合物和固化产物。

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• 5. Preparation of a Novel Phosphorus-Nitrogen Containing Novolac Curing Agent for Epoxy Resin and flame-retardancy of its cured epoxy resin [O] . Hui Qiao, Yun Liang, Guilong Xu, 2019
• 6. Critical parameters for electron beam curing of cationic epoxies and property comparison of electron beam cured cationic epoxies versus thermal cured resins and composites [R] . Janke, C. J. , Norris, R. E. , Yarborough, K. , 1997

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