1291377 Depilatory compositions L'OREAL 4 Feb 1970 [4 Feb 1969] 5284/70 Heading A5B Depilatory compositions comprising a flexible support, having on at least one face thereof a composition having a pH greater than 7 and comprising an organic thiol, an adhesive and, if necessary, a basic substance in an amount sufficient to bring the pH of the composition to above 7, said adhesive being (a) one capable of adhering to the skin and to hair sufficiently to allow the hair to be removed, after the thiol has acted on the hair, by the depilatory composition and (b) one whose adhesive forces to the support are greater than the adhesive forces to the skin. The support may comprise a sheet of paper or of a synthetic resin, which may or may not be perforated, or of a textile material. Alternatively the support may be prepared in situ on the skin and the depilatory composition contains a film-forming product (such as a wax or polymer which is soluble in a solvent also present) e.g. an acrylate or a methacrylate, or a polymerisable monomer; such composition may be in the form of a solution, cream, gel or an aerosol. The adhesive may be ethyl cyanacrylate and the organic thiol may be an alkali metal mercapto-carboxylic acid salt such as a sodium, potassium or lithium salt of thioglycollic acid, or of - or #-mercapto propionic acid. The film-forming product may also constitute the adhesive. The composition may have a pH from 10 to 12 and may also contain a wetting agent such as an alkaline earth metal sa a swelling agent such as urea, thiourea, melamine, guanidine or an alkali metal thiocyanate; and/or a hair-removing accelerator such as an alkali metal or alkaline earth metal thiocyanate, melamine or dicyandiamide. The adhesive substance and/or the basic substance giving the composition a pH greater than 7 and/or optionally the film-forming product and/or hair-removing accelerator are present in the depilatory in micro-encapsulated form, the walls of the micro-capsules being sufficiently thin to be able to break under the effect of crushing. A preferred encapsulating material is a polyethylene having a melting point from 110‹ to 140‹C and the microcapsules may be present on the support or may be contained in an aerosol composition.
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