Plating solutions - cyanide free plating solution for deposition of gold/palladium alloys

摘要

A cyanide free plating bath contg. 1-50 g/l Au potassium gold sulphite and 0.05-10 g/l of a soluble Pd salt or complex together with =1 metallic element such as Cu, Ni, Ba etc. at 10 mg)l - 30 g/l plus 10 mg/l - 30 g/l of N contg. cpd. e.g. NH3 or complex organic nitro cpds. such as polyamines etc. and a chelating agent such as oxalic or citric acid etc., is proposed. Buffering agents e.g. H3PO4 maintain pH at 5.5-11, plating temps. are 20-85 degrees C at 0.1-3A/dm2. The alloy layer deposited can be used for electronic circuitry or decoration and possesses good coloration and strength. The colour may be varied depending on which other metallic ions are present in the plating solution. Thick layers =50 mu may be deposited.