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A method for catalytic seeding the nonmetallic surfaces for a subsequent, electroless metallization and bath solutions for carrying out the method
A method for catalytic seeding the nonmetallic surfaces for a subsequent, electroless metallization and bath solutions for carrying out the method
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机译:一种用于非金属表面的催化晶种方法,用于随后的化学镀金属和镀液的实施方法
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摘要
The present invention provides copper (I) ion compound bath solutions for the catalytic sensitization and metallization by electroless metal deposition of non-metallic surfaces, as well as processes for the application and re-claiming of said solutions.
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