首页> 外国专利> process for stabilre electrical contacts on a thin layer of tantalum capacitors apparatenenti especially in networks composed of capacitors and resistors over a thin layer of thin layer

process for stabilre electrical contacts on a thin layer of tantalum capacitors apparatenenti especially in networks composed of capacitors and resistors over a thin layer of thin layer

机译:稳定钽电容器薄层上的电触点的方法,特别是在由薄层薄层上的电容器和电阻器组成的网络中

摘要

A method for electrically bonding tantalum thin film capacitor networks to other networks is described. A first non-conducting support member has a thin film tantalum capacitor mounted thereon. A second non-conducting support member has another component such as a resistor mounted thereon. The two non-conducting support members are placed in a back-to-back position so that the thin film tantalum capacitor and the other component are remote from each other. These two non-conducting support members are then bound together and dipped into a molten solder bath to form a solder coating on the metal elements of the completed network.
机译:描述了一种将钽薄膜电容器网络电连接到其他网络的方法。第一不导电支撑构件具有安装在其上的薄膜钽电容器。第二不导电支撑构件具有另一组件,例如安装在其上的电阻器。两个不导电的支撑构件以背对背的位置放置,使得薄膜钽电容器和另一组件彼此远离。然后将这两个不导电的支撑构件绑在一起,并浸入熔融的焊料槽中,以在完整网络的金属元件上形成焊料涂层。

著录项

  • 公开/公告号IT1058511B

    专利类型

  • 公开/公告日1982-05-10

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号IT19760021519

  • 发明设计人

    申请日1976-03-24

  • 分类号H01G;

  • 国家 IT

  • 入库时间 2022-08-22 13:29:51

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