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Methods of producing Schottky barrier silicide contacts on silicon subtrates and silicon semiconductor devices provided with Schottky barrier silicide contacts

机译:在硅衬底上生产肖特基势垒硅化物触点的方法以及具有肖特基势垒硅化物触点的硅半导体器件

摘要

Rare earth disilicide Schottky barriers are used as low resistance contacts (Schottky barrier of ≲0,4 eV) to n-type Si and high resistance contacts (Schottky barrier of 0,7 eV) to p-type Si. High (≳0,8 eV) and low (≲ 0,4 eV) energy Schottky barriers can be formed contemporaneously on an n-doped silicon substrate. Illustratively, the high energy Schottky barrier is formed by reacting platinum or iridium with silicon; the low energy Schottky barrier is formed by reacting a rare earth with silicon to form a disilicide. A composite layer of Pt on W is an effective diffusion barrier on Gd and prevents the Gd from oxidation.
机译:稀土二硅化物肖特基势垒用作n型Si的低电阻触点(≲0.4eV的肖特基势垒)和p型Si的高电阻触点(> 0.7 eV的肖特基势垒)。高能量(≳0.8eV)和低能量(≲0.4 eV)肖特基势垒可以同时形成在n型掺杂硅衬底上。说明性地,高能肖特基势垒是通过使铂或铱与硅反应而形成的。低能肖特基势垒是通过稀土与硅反应形成二硅化物而形成的。 W上的Pt复合层是Gd上的有效扩散阻挡层,可防止Gd氧化。

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