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MANUFACTURE OF ELECTRIC PARTS

机译:电气零件制造

摘要

PURPOSE:To avoid the deterioration of an enamel coating and to obtain the high insulation breakdown voltage by using a curing agent without a double bond in the molecules of 50mol% or more of an acid anhydride curing agent to be impregnated in resin when the electric parts including a polyestel enamel copper wire as a material for composing a coil is subjected to an electrical insulation treatment by use of an acid anhydride curing type epoxy resin composition. CONSTITUTION:When the electric parts including a polyestel enamel copper wire as a material for composing a coil is subjected to an electrical insulation treatment, an acid anhydride curing type epoxy resin composition is used for insulation. At this time, there is no particular restriction regarding the epoxy resin and diglycyzirether, deriviatives thereof and etc. are available. For an acid anhydride, hexahydrophthalic acid anhydride, methylhexahydrophthalic acid anhydride and denaturalized substances thereof are used. In addition, for the acid anhydride, the substance without a double bond in molecules is selected and even if the double bond is included, it is restrained at 50% of less.
机译:用途:为避免搪瓷涂层变质并通过在电气部件中浸渍50%或更多的酸酐固化剂的分子中使用不带双键的固化剂来获得高绝缘击穿电压通过使用酸酐固化型环氧树脂组合物对包括聚酯搪瓷铜线作为构成线圈的材料的材料进行电绝缘处理。组成:当对包括搪瓷铜线作为组成线圈材料的电气部件进行电绝缘处理时,应使用酸酐固化型环氧树脂组合物进行绝缘。此时,对环氧树脂和二甘氨酰醚,其衍生物等没有特别限制。对于酸酐,使用六氢邻苯二甲酸酐,甲基六氢邻苯二甲酸酐及其变性的物质。另外,对于酸酐,选择分子中不具有双键的物质,即使包含双键,也将其限制在50%以下。

著录项

  • 公开/公告号JPS6072211A

    专利类型

  • 公开/公告日1985-04-24

    原文格式PDF

  • 申请/专利权人 HITACHI KASEI KOGYO KK;

    申请/专利号JP19830179544

  • 发明设计人 KIKUCHI MASAO;KAGEYAMA AKIRA;

    申请日1983-09-28

  • 分类号H01F41/12;

  • 国家 JP

  • 入库时间 2022-08-22 08:24:59

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