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METHOD FOR BONDING SEMICONDUCTIVE CONSTITUTIONAL ELEMENT HAVING LARGE AREA AND CONSTITUTIONAL MEMBER USED AS SUBSTRATE SO AS NOT CONTAIN AIR BUBBLES
METHOD FOR BONDING SEMICONDUCTIVE CONSTITUTIONAL ELEMENT HAVING LARGE AREA AND CONSTITUTIONAL MEMBER USED AS SUBSTRATE SO AS NOT CONTAIN AIR BUBBLES
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机译:具有较大面积的半导电本构元素的粘结方法,以及用作基质而不包含气泡的本构成员
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摘要
A large-area semiconductor component (1) is joined without bubbles by means of soldering to a substrate (2) by placing a perforated metallic intermediate layer (5) between the solder (3) before the soldering and the substrate (2) and the assembly is brought to soldering temperature under pressure and perpendicular to the soldering plane. During this process, the solder (4) completely fills the cavities between the components (1, 2) and (5) after the soldering and drives gas bubbles and any impurities to the periphery of the assembly, a constant distance being maintained between the semiconductor component (1) and the substrate (2). The intermediate layer (5) is preferably constructed as structured foil or as metallic fabric.
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