Solution a liquid, alkaline, aqueous, of namn04, process to prepare a substrate resin, process for desuntar aperfeicoado resin walls of holes.The process aperfeicoado for cleaning hole and process for attacking the part support surface of a panel circuit.

摘要

Aqueous, alkaline liquid NaMnO4 solutions are provided which provide excellent resin desmearing and etchback, especially in the manufacture of printed circuit boards. The solutions comprise water, alkali metal hydroxide, NaMnO4 and from about 0.1 to about 3.0 moles per mole of MnO4- of a co-ion for MnO4- selected from the group consisting of K+, Cs+, Rb+ and mixtures thereof.