首页> 外国专利> INP / GAINASP LASER DIODE WITH A CURRENT ACTIVE LAYER, WITH DOUBLE-CHANNEL CARRIER AND WITH A DOUBLE-BUILT, BUILT-IN, BARRIER-HETEROSTRUCTURE-CONTAINING P-N TRANSITION AND THEIR PREPARATION USING THE ONE-STAGE FLUIDITY-PITAXIAL METHOD

INP / GAINASP LASER DIODE WITH A CURRENT ACTIVE LAYER, WITH DOUBLE-CHANNEL CARRIER AND WITH A DOUBLE-BUILT, BUILT-IN, BARRIER-HETEROSTRUCTURE-CONTAINING P-N TRANSITION AND THEIR PREPARATION USING THE ONE-STAGE FLUIDITY-PITAXIAL METHOD

机译:INP / GAINASP激光二极管,具有有源层,双通道载体,双壁,内置,含阻挡层-异质结构的P-N过渡以及使用单级流态-垂直方法的制备

摘要

InP/GaInAsP double heterostructure laser diode with buried active layer, and method for its production. The InP/GaInAsP laser diode containing a built-in isolating p-n junction with a double channeled double heterostructure carrier, and a buried active layer built up on an InP substrate, is prepared by using the method of one-step liquid phase epitaxy, wherein on the orientated substrate (1) there are formed two parallel channels (9), between which channels (9) a buried GaInAsP active layer (3a) is arranged, which is confined on all sides by n and p type InP layers with a wide inhibiting zone and a low refractive index. On the substrate (1) there is a n-type InP buffer layer (2) and thereon a further GaInAsP layer (3) with narrow gap and lying at the bottom of the channels (9) and on the planar parts, whereon a further n-type layer (4) is arranged carrying a further n-type current-limiting layer (5), whereon an InP embedding layer (6) is provided on which a GaInAsP contact layer (7) of the p-type is arranged, while this one is covered with a multilayer p-side contact-metal layer (8a), advantageously of Au/Au-Zn , while on the other side of the carrier a n-side contact-metal layer (8b) is directly arranged, preferably consisting of AuGe/Ni/Au.
机译:具有埋入式有源层的InP / GaInAsP双异质结构激光二极管及其制造方法。使用一步液相外延方法制备InP / GaInAsP激光二极管,该二极管包含带有双沟道双异质结构载流子的内置隔离pn结以及在InP衬底上构建的掩埋有源层,其中在定向衬底(1)上形成两个平行的通道(9),在这些通道之间布置有掩埋的GaInAsP有源层(3a),该埋入的GaInAsP有源层(3a)在所有侧面上都被n和p型InP层所限制,具有宽的抑制作用。区域和低折射率。在衬底(1)上有一个n型InP缓冲层(2),在其上还有一个窄间隙的GaInAsP层(3),位于沟道(9)的底部和平面部分上,在上面布置n型层(4),其携带另外的n型限流层(5),在其上设置InP嵌入层(6),在其上布置p型的GaInAsP接触层(7),虽然该层被多层p侧接触金属层(8a)覆盖,最好是Au / Au-Zn,而在载体的另一侧上直接布置了n侧接触金属层(8b),优选由AuGe / Ni / Au组成。

著录项

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号