Semiconductor module with several semiconductors on basic substrate - has cover substrate for all semiconductors with conductive track configuration with terminal face(s)

摘要

Between each semiconductor (6) of the module and one or several terminal faces (3,4) on the basic substrate (1) is formed at least one conductive connection. A cover substrate (2) lies over all semiconductors, which has a conductive track structure with at least one coupling terminal face (5). The coupling terminal face forms at least one further conductive connection to all semiconductors. Pref. the basic and cover substrates are of insulating material with mutually facing coupling terminal faces. The terminal faces on the cover substrate are conductively coupled to the semiconductor or the basic substrate. ADVANTAGE - No bonding drawbacks for power semiconductor modules.