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Water-soluble, film-forming inorganic compounds, fireproof and fire- resistant composites and fire-resistant, flexible, sheet composite covering materials formed by the use of the compounds, and process for preparing fire-resistant coverings
Water-soluble, film-forming inorganic compounds, fireproof and fire- resistant composites and fire-resistant, flexible, sheet composite covering materials formed by the use of the compounds, and process for preparing fire-resistant coverings
Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
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