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Ultrasonic test head arrangement for metal sheet bonding - uses highly-damped LF impact wave sound head with measured frequency decreasing as thickness of plate assembly increases
Ultrasonic test head arrangement for metal sheet bonding - uses highly-damped LF impact wave sound head with measured frequency decreasing as thickness of plate assembly increases
The arrangement non-destructive testing of the binding or adhesiveness between sound-conductive plates, esp. metal sheets, is applicable to aircraft fuselage testing. The test head has a sound sender and receiver. Under contactless sound coupling conditions, the head sends sounds through at least one bonding or adhesive layer (4) between the plates (6). The test head is in the form of a highly damped, l.f. impact wave head (12) reaching a highest freq. of 2 MHz for the thinnest plates. For a total plate thickness lying between 1.5 and 5 mm the assigned head freq. is reduced from 1 to 0.5 MHz. USE/ADVANTAGE - Rapid, highly sensitive quality judgment of bonding or adhesive layer (5) inside test piece.
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