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SIMULTANEOUS FORMATION OF FILMS BY SPUTTERING ON PLURAL SUBSTRATES AND DEVICE THEREFOR AND SYSTEM FOR SIMULTANEOUSLY FORMING FILMS ON PLURAL SUBSTRATES
SIMULTANEOUS FORMATION OF FILMS BY SPUTTERING ON PLURAL SUBSTRATES AND DEVICE THEREFOR AND SYSTEM FOR SIMULTANEOUSLY FORMING FILMS ON PLURAL SUBSTRATES
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机译:通过溅射在多个衬底上同时形成薄膜及其装置和用于在多个衬底上同时形成薄膜的装置和系统
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摘要
PURPOSE: To efficiently and simultaneously stick sputtered particles to plural substrates at a uniform film thickness. ;CONSTITUTION: Magnetic lines of force are repulsed by each other and are formed as flattened magnetic lines of force if the distances between the substrates 4 and targets 13 are set at 1.5 to 2/5 the diameter of the substrates 4 and currents of the same polarity are passed to coils 11a to 11c. Plasma can eventually be generated stably in the central parts of the targets 13 as well and the formation of the films by sputtering in the central parts of the targets 13 is possible. On the other hand, the films can be formed stably by sputtering even in the outer peripheral parts of the targets 13 if the currents of the same polarity are passed to the coils 11a, 11b and the current of the reverse polarity is passed to the coil 11c.;COPYRIGHT: (C)1993,JPO&Japio
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