ONE-FACE POLISHING METHOD OF SILICON WAFER BY BOTH-FACE POLISHING MACHINE

摘要

PURPOSE: To enable planar working of high precision and high smoothness by hydrophilically treating each surface of two silicon wafers, by adhering and sticking these surfaces, and by polishing both outside surfaces. ;CONSTITUTION: The respective etching surfaces 1a, 2a of two silicon wafers 1, 2 so ground and etched as to be TTV2μm, LTV1μm or less in a class 1 clean room are hydrophilically treated with the result that these surfaces 1a, 2a are adhered. The silicon wafers 1, 2 are clamped by surface plates 14, 16. Next, while a liquidlike polishing agent is supplied continuously to polish cloths 13, 15, the surface plates 14, 16 are rotated to polish unetched surfaces 1b, 2b of the silicon wafers 1, 2. This process enables planar working of high precision and high smoothness without using wax.;COPYRIGHT: (C)1993,JPO&Japio