首页> 外国专利> Non-contact semiconductor wafer height measuring appts. for circuit testing system - has platform for carrying semiconductor wafer and platform driving system for driving platform in determined direction and distance measuring unit

Non-contact semiconductor wafer height measuring appts. for circuit testing system - has platform for carrying semiconductor wafer and platform driving system for driving platform in determined direction and distance measuring unit

机译:非接触式半导体晶圆高度测量装置。用于电路测试系统-具有用于承载半导体晶片的平台和用于在确定的方向和距离测量单元中驱动平台的平台驱动系统

摘要

The distance measuring unit (20) is fixed at a distance from the platform (3) in the determined direction. A light source transmits a light beam (L) directed on the semiconductor system . A sensor receives a light beam reflected from the semiconductor system. A drive unit is provided, which determines a distance to the semiconductor system , on the basis of an output signal of the sensor. A control unit (30), controls the platform driving system (10Z) in such away, that the platform is positioned in the determined direction, on the basis of an output signal of the distance measuring unit. USE/ADVANTAGE - Determining faults in semiconductor wafers. Height position of semiconductor system can be correctly measured, exactly adjusted without damage to semiconductor system.
机译:距离测量单元(20)在确定的方向上与平台(3)相距一定距离。光源透射指向半导体系统的光束(L)。传感器接收从半导体系统反射的光束。提供了一种驱动单元,其基于传感器的输出信号来确定到半导体系统的距离。控制单元(30)基于距离测量单元的输出信号控制平台驱动系统(10Z),使得平台沿确定的方向定位。使用/优势-确定半导体晶圆中的故障。可以正确测量半导体系统的高度位置,准确调整其高度,而不会损坏半导体系统。

著录项

  • 公开/公告号DE4232277A1

    专利类型

  • 公开/公告日1993-06-17

    原文格式PDF

  • 申请/专利权人 MITSUBISHI DENKI K.K. TOKIO/TOKYO JP;

    申请/专利号DE19924232277

  • 发明设计人 YAMAMOTO AKEMI ITAMI HYOGO JP;

    申请日1992-09-25

  • 分类号H01L21/66;G05D3/12;G01R31/28;

  • 国家 DE

  • 入库时间 2022-08-22 05:01:17

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