ELECTRONIC APPARATUS EQUIPMENT AND LAP TOP ELECTRONIC APPARATUS EQUIPMENT

摘要

PURPOSE: To cool a heating member by efficiently transmitting the heat, which is generated by the heating member, to a radiating member installed in an arbitrary place independently of the arrangement state of members even in a device where the heating member is mounted in a narrow space together with other members. ;CONSTITUTION: Semiconductor elements 1 mounted on printed boards 2 are provided with headers 5. Headers 5 are connected to a header 6, which is attached to a radiation fin 7 provided in the end part of the enclosure, by flexible tubes 9. Heat generated by respective semiconductor elements 1 is collectively radiated out of the enclosure from the part of the radiation fin 7 by transporting liquid between tubes. Though many semiconductor elements are arranged in a narrow space, semiconductor elements generating the heat much and the radiation fin are easily thermally connected independently of the mounted state of the device because flat headers and flexible tubes are used.;COPYRIGHT: (C)1994,JPO&Japio