首页> 外国专利> Fast-switching semiconductor junction device mfr. by double diffusion - by partial or total dissociation of iron-gold complexes during tempering at e.g. 300 deg.C to shorten carrier lifetime

Fast-switching semiconductor junction device mfr. by double diffusion - by partial or total dissociation of iron-gold complexes during tempering at e.g. 300 deg.C to shorten carrier lifetime

机译:快速开关半导体结器件通过双重扩散-通过在例如温度下回火期间铁-金络合物的部分或全部解离。 300摄氏度可缩短载流子寿命

摘要

A diode with a blocking voltage greater than 1 kV is formed from a heavily-doped p-type layer (1), a lightly-doped n-type layer (2) forming a p-n junction (4), and a heavily-doped n-type layer (3) with a 10 nm thick Au film (5) vapour-deposited on its surface and diffused homogeneously e.g. for one hour at 900 deg.C. A layer (6) of Fe is sputtered on to the p+ layer (1) and diffused by rapid thermal annealing to produce an increased impurity concn. below the junction. ADVANTAGE - Carrier lifetime can be reduced greatly in desired part of lightly-doped region for very effective inhomogeneous impurity distribution profile with optimal switching properties.
机译:由重掺杂的p型层(1),形成pn结(4)的轻掺杂的n型层(2)和重掺杂的n形成二极管,其阻断电压大于1 kV。型膜(3),其表面沉积有10 nm厚的金膜(5),并均匀扩散,例如在900℃下放置一小时Fe层(6)溅射到p +层(1)上,并通过快速热退火扩散,以产生增加的杂质浓度。在路口下方。优势-轻掺杂区的所需部分的载流子寿命可以大大降低,以实现具有最佳开关特性的非常有效的不均匀杂质分布曲线。

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