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Negative image process utilizing photosensitive compositions containing aromatic fused polycyclic sulfonic acid and partial ester or phenolic resin with diazoquinone sulfonic acid or diazoquinone carboxylic acid, and associated imaged article
Negative image process utilizing photosensitive compositions containing aromatic fused polycyclic sulfonic acid and partial ester or phenolic resin with diazoquinone sulfonic acid or diazoquinone carboxylic acid, and associated imaged article
A photosensitive composition having contrast and selectivity, useful in forming high resolution patterns.PPThe composition comprises a phenolic resin, a diazoquinone compound and an aromatic fused polycyclic sulfonic or carboxylic acid, in the form of the free acid and/or an ammonium salt and/or an acid halide, the cation component of the ammonium salt having the formula ##STR1## wherein R.sub. 1, R.sub.2, R. sub.3 and R.sub.4, each represent hydrogen, C.sub.1 -C.sub. 4 -alkyl or C. sub.1 -C.sub.4 -hydroxyalkyl.PPIn forming a negative pattern, the composition is coated on a substrate and exposed imagewise to ultraviolet radiation, thereafter treated with a silicon compound, whereby the silicon compound is selectively absorbed into the irradiated portions and the non-irradiated portions are then removed by dry etching.
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