首页> 外国专利> 4,4' bis (3 aminohuenokishi) 3,3', 5,5' tetoramechirubihueniru and its production manner

4,4' bis (3 aminohuenokishi) 3,3', 5,5' tetoramechirubihueniru and its production manner

机译:4,4'bi s(3 Ami no Fuenokishi)3,3',5,5'Tetorame Chirubi Fueniru An and ts p Rozu c Chion Mane r

摘要

NEW MATERIAL:4,4'-Bis(3-aminophenoxy)-3,3',5,5'-tetramethylbiphenyl of formula I. USE:Useful as a raw material for polyimide resin having excellent heat-resistance, processability and high-temperature adhesivity. It has high utility as a base for aerospace vehicle and air craft, base for electrical and electronic parts, heat-resistant adhesive, etc., and can be used in various uses. PREPARATION:The objective compound of formula I can be produced by condensing 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and m-dinitrobenzene in the presence of a base in an aprotic polar solvent such as N,N- dimethylformamide preferably at 120-180 deg.C and reducing the obtained 4,4'-bis(3- nitrophenoxy)-3,3',5,5'-tetramethylbiphenyl of formula II.
机译:新材料:式I的4,4'-双(3-氨基苯氧基)-3,3',5,5'-四甲基联苯。用途:用作耐热性,加工性和高耐候性的聚酰亚胺树脂的原料温度粘合性。它作为航空航天器和飞机的底座,电气和电子零件的底座,耐热胶粘剂等具有很高的用途,并且可以用于各种用途。制备:式I的目标化合物可通过在非质子极性溶剂(例如N)中在碱的存在下缩合4,4'-二羟基-3,3',5,5'-四甲基联苯和间二硝基苯来制备。 N-二甲基甲酰胺优选在120-180℃下还原得到的式II的4,4'-双(3-硝基苯氧基)-3,3',5,5'-四甲基联苯。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号