PURPOSE: To efficiently execute cathode sputtering with a system reduced in size by transporting substrates via a perpendicular substrate carrier in a perpendicular process chamber and passing the substrates to a cathode station disposed at a perpendicular wall section. ;CONSTITUTION: The flat annular process chamber 28 constituted by connecting flat perpendicular walls 7, 8 with webs 9, 10 is perpendicularly installed via a stand 1. The substrate carrier 3 consisting of transporting rings rotated by driving devices 12 to 15 in the processing chamber 28 which is made to a vacuum state is perpendicularly arranged. Substrate receptors are disposed in the positions 4... of the substrate carrier 3. Further, substrate loading/unloading stations 25, 26 are installed in the positions 16 of the perpendicular walls 7, 8 and cathode stations 21 to 24 in the positions 17, 18. While the substrates are transported by the cathode sputtering device 2 described above, the substrates are efficiently subjected to cathode sputtering.;COPYRIGHT: (C)1990,JPO
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