THICK FILM COPPER COMPOSITION FOR THICK CONDUCTIVE COATING FORMATION WITH HIGH PLATING RESISTANCE

摘要

PURPOSE: To form a conductive coating which can keep high adhesion strength to a substrate even after plating process by containing zinc oxide and titanium oxide in a composition consisting of metal copper powder, glass frits, and an organic liquid vehicle. ;CONSTITUTION: A thick film copper composition for thick conductive coating formation with high plating resistance is prepared from 100 parts by weight of metal copper powder, about 2-7 parts by weight of glass frits, about 1-5 parts by weight of zinc oxide, about 0.5-5 parts by weight of titanium oxide, and an organic liquid vehicle. The copper composition is fired in nitrogen atmosphere at about 900-1000°C to form a plating resistant conductive coating. By this method, a plating resistant conductive coating 2 is formed on a substrate 1 and then a plating layer 3 is formed. The conductive coating 2 is composed of a glass phase 4 of mainly glass in the substrate 1 side, a copper layer 5 of mainly copper in the plating layer 3 side, and an interlayer phase 6 of mainly zinc oxide and titanium oxide in the interlayer of the substrate and the plating layer. The conductive coating 2 is sufficiently resistant against acid-alkali treatment and hydrothermal treatment at the time of plating process.;COPYRIGHT: (C)1995,JPO